Packaging technologies are now the leading supplier of the best silicon technology and contribute to making some of the best CPUs that you can buy. Embedded Multi-Die Interconnect Bridge (EMIB) and its natural evolution, the Foveros or the TSMC’s hybrid bonding technique are indispensable steps towards the denser, 2.5D or even 3D silicon integrations. The software allows manufacturers to use Multi-Chip-Module (MCM) accelerators in the hybrid universe. These transforms the den into a single chip. This technology is essential for the cost of reducing production costs with high efficiencies. With that being true, the world’s most powerful accelerators could be fabricated with a pure engineering perspective. In addition to MCM designs, the techniques of silicon bonding enable “simple” vertical scaling of electronics chips. AMD, for example, is rapidly launching a partially-updated Ryzen 5000 series line-up incorporating the hybrid bonding of TSMC under its (recently submitted for trademark) V-Cache branding. The investment of the year, which will be announced in Malaysia, will take over seven billion dollars. Intel has already allocated 3,5 billion for the new Mexico and Rio Rancho facility, which also specialises in Intel’s Fovero and EMIB packaging technologies. The resuscitation of the ear of a man is high. It also highlights the difficulty of reducing production capacity during the global pandemic, in time for the rapid growth of incoming demand – the fact that if it is done to a large extent, production capacity will need to be added at an instant. The investment in the Malaysian facilities will not only allow Intel to support the next generation HPC, but it can also serve as a tool of the IDM 2.0 strategy. That’s also important, Intel is likely investing in its packaging technologies outside the US to prevent such a situation from occurring in the political field. The ever-growing trade war with China has had an impact on Intel’s investment and Chinese fab expansion projects. Intel has recently intervened in the U.S. International Trade Commission’s plan to ban Optiplan, a specific semiconductor manufacturing component imported to Intel’s U.S. facilities. Of course, adding manufacturing and packaging capabilities in Taiwan would bring Intel’s manufacturing closer to China’s world’s most important semiconductor materials source, a potential reduction in supply chain costs.
