Intels Future Bet Is For Performance Stacking Transistors

Intels Research Components Group announced a roadmap for the upcoming ten years at an event in San Francisco. A research paper into a method for stacking transistors was one of the company’s new innovations, but that could result in a 60% boost in the transistor density. Processor chips are now flat, with all the transistors being flat on all sides. The new method includes other chicklets from the existing design to increase the transistor count without requiring a bigger surface area. By stacking the devices directly on top of each other, were clearly saving area, told Reuters. Were reducing the length of interconnects and saving energy, making this both more cost efficient and more efficient. This makes sense in current chips and other systems, although the transistors are being connected to, so they can make changes, which produce more energy. AMD’s biggest rival already has a 3D V-cache in the Zen 3 refresh and the next generation Zen 4 processor. AMDs solution is a little different because it only stacks the L3 cache and not the transistors itself. It is important to note that Intels stack transistors won’t appear for several years. The first major change will be 2024, when Intel is due to replace its transistor architecture with RibbonFET. RibbonFET isn’t the only advancement in Intel’s roadmap. According to PC Mag, the company is also looking for an additional power supply process called PowerVia as part of its 20A manufacturing process. Intels 20A is expected to become an autonomous vehicle until 2024. This is the first of the companies who made these units, which are the first to be made using ultraviolet radiation that will convert to high numerical aperture.

title: “Intels Future Bet Is For Performance Stacking Transistors” ShowToc: true date: “2022-11-06” author: “Sandra Garcia”

Intels Research Components Group announced a roadmap for the upcoming ten years at an event in San Francisco. A research paper into a method for stacking transistors was one of the company’s new innovations, but that could result in a 60% boost in the transistor density. Processor chips are now flat, with all the transistors being flat on all sides. The new method includes other chicklets from the existing design to increase the transistor count without requiring a bigger surface area. By stacking the devices directly on top of each other, were clearly saving area, told Reuters. Were reducing the length of interconnects and saving energy, making this both more cost efficient and more efficient. This makes sense in current chips and other systems, although the transistors are being connected to, so they can make changes, which produce more energy. AMD’s biggest rival already has a 3D V-cache in the Zen 3 refresh and the next generation Zen 4 processor. AMDs solution is a little different because it only stacks the L3 cache and not the transistors itself. It is important to note that Intels stack transistors won’t appear for several years. The first major change will be 2024, when Intel is due to replace its transistor architecture with RibbonFET. RibbonFET isn’t the only advancement in Intel’s roadmap. According to PC Mag, the company is also looking for an additional power supply process called PowerVia as part of its 20A manufacturing process. Intels 20A is expected to become an autonomous vehicle until 2024. This is the first of the companies who made these units, which are the first to be made using ultraviolet radiation that will convert to high numerical aperture.